Typical Application Scenarios

The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products. The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model. Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.

Main Characteristics

Technical Specifications